PUBLICATIONS – Journals

  1. K. Sumaria and T. Liu, “A Subtractive Method to Chemically Pattern Liquid Metal for Stretchable Circuits,” Advanced Materials Technologies, DOI: 10.1002/admt.202401200.
  2. J. Cheng and T. Liu, “Heterogeneous micro-architectonic integration of SU-8 and highly entangled polyacrylamide hydrogel to realize cut-resistant soft superhydrophobic surfaces,” Journal of Micromechanics and Microengineering, doi: 10.1088/1361-6439/ad76b6.
  3. B. Wang et al., “An implantable multifunctional neural microprobe for simultaneous multi-analyte sensing and chemical delivery,” Lab Chip, vol. 20, no. 8, pp. 1390–1397, Apr. 2020, doi: 10.1039/D0LC00021C.
  4. Y. Shen*, T. Liu*, J. Chen*, X. Li, L. Liu, J. Shen, J. Wang, R. Zhang, M. Sun, Z. Wang, W. Song, T. Qi, Y. Tang, X. Meng, L. Zhang, D. Ho, C.-M. Ho, X. Ding, and H. Lu, “Harnessing Artificial Intelligence to Optimize Long-Term Maintenance Dosing for Antiretroviral-Naive Adults with HIV-1 Infection,” Advanced Therapeutics, vol. n/a, no. n/a, p. 1900114, Nov. 2019. [Full Text] [pdf]
  5. Man, X. Zhu, Y. T. Chow, E. R. Dawson, X. Wen, A. N. Patananan, T. Liu, C. Zhao, C. Wu, J. S. Hong, P.-S. Chung, D. L. Clemens, B.-Y. Lee, P. S. Weiss, M. A. Teitell, P.-Y. Chiou, “Intracellular Photothermal Delivery for Suspension Cells Using Sharp Nanoscale Tips in Microwells,” ACS Nano, Sep. 2019.
  6. J. Li, N. S. Ha, T. Liu, R. M. van Dam, and C.-J. Kim, “Ionic-surfactant-mediated electro-dewetting for digital microfluidics,” Nature, vol. 572, no. 7770, pp. 507–510, Aug. 2019. [Abstract] [Full Text]
  7. X. Wen, B. Wang, S. Huang, T. Liu, M.-S. Lee, P.-S. Chung, Y. T. Chow, I-W. Huang, H. G. Monbouquette, N. T. Maidment, and P.-Y. Chiou, “Flexible, multifunctional neural probe with liquid metal enabled, ultra-large tunable stiffness for deep-brain chemical sensing and agent delivery”, Biosensors and Bioelectronics, vol. 131, pp. 37–45, Apr. 2019. [pdf][pdf]
  8. T. Chow, T. Man, G. Acosta, X. Zhu, X. Wen, P.-S. Chung, T. Liu, B. Wu, and P.-Y. Chiou, “Liquid metal-based multifunctional micropipette for 4D single cell manipulation”, Advanced Science, vol. 5, no. 7, p. 1700711, May 2018. [pdf]
  9. T. Liu, and C.-J. Kim, “Contact angle measurement of small capillary length liquid in super-repelled state,” Scientific Reports, vol. 7, no. 1, p. 740, Apr. 2017. [pdf]
  10. T. Liu, Z. Chen, and C.-J. Kim, “A dynamic Cassie-Baxter model, ” Soft Matter, Vol. 11, Iss. 8, Feb. 2015, pp. 1589–1596. [pdf]
  11. T. Liu and C.-J. Kim, “Turning a surface superrepellent even to completely wetting liquids,” Science, Vol. 346, Iss. 6213, Nov. 2014, pp. 1096-1100. [Full Text]
  12. G. Sun, T. Liu, P. Sen, W. Shen, C. Gudeman and C.-J. Kim, “Electrostatic Side-Drive Rotary Stage on Liquid-Ring Bearing,” Journal of Microelectromechanical Systems. Vol. 23, Iss.1, Feb. 2014, pp. 147-156. [pdf]
  13. T. Liu, P. Sen, and C.-J. Kim, “Characterization of Nontoxic Liquid-Metal Alloy Galinstan® for Applications in Micro Devices,” Journal of Microelectromechanical Systems, Vol. 21, Iss. 2, April 2012, pp. 443-450. [pdf]

PUBLICATIONS – Conference Proceedings

  1. Q. Sun and T. Liu, “Transferring Soft Doubly Re-entrant Microstructures for Mechanically Resilient Omniphobic Surfaces,” Proceeding of Solid-State Sensors, Actuators, and Microsystems Workshop (Hilton Head’24), Hilton Head Island, South Carolina, USA, Jun. 2024, pp. 275-277. (Best paper finalist) {POSTER}
  2. J. Cheng and T. Liu, “Enabling Cut-Resistant Superhydrophobic Surfaces Using a Highly Entangled Soft Polymeric Substrate,” Proceeding of Solid-State Sensors, Actuators, and Microsystems Workshop (Hilton Head’24), Hilton Head Island, South Carolina, USA, Jun. 2024, pp. 247-250.
  3. Q. Sun and T. Liu, “Engineering 3D Hierarchical Structures with Bio-mimetic Solid Fraction Gradient,” Proc. IEEE Int. Conf. MEMS, 2024, Austin, USA, Jan. 21-25, pp 658-660.
  4. K. Sumaria, H. Geng, T. Liu, “Chronic Dielectric Performance of Parylene-modified Polydimethylsiloxane for Insulating Stretchable Electronics”, Proc. IEEE SENSORS 2023, Vienna, Austria, Oct. 2023.
  5. J. Cheng and T. Liu, “Controllable Static Breath-Figure Processes to Form Ordered 3-D Microstructures on Polydimethylsiloxane without Lithography and Molding,” Proceeding of Solid-State Sensors, Actuators, and Microsystems Workshop (Hilton Head’22), Hilton Head Island, South Carolina, USA, Jun. 2022, pp. 242–245.
  6. Q. Sun, T. Liu, “Deformable Superoleophobic Surfaces with High Mechanical Resilience,” Proc. IEEE Int. Conf. MEMS, Online, Jan. 2021, pp. 71-74.
  7. K. Sumaria, T. Liu, “Massively Parallel Liquid Metal Wiring for Soft Electronics and Robotics,” Proc. IEEE Int. Conf. MEMS, Vancouver, Canada, Jan. 2020, pp. 24-27.
  8. X. Zhu, T. Man, T. Nguyen, M. Haw, T. Liu, X. Wen, M. A. Teitell, P.-Y. Chiou, “Parallel Nanomechanical Indentation Platform Using Quantitative Phase Imaging”, Proc. IEEE Int. Conf. on Optical MEMS and Nanophotonics (OMN), Lausanne, Switzerland, Jul. 2018.
  9. T. Man, X. Zhu, Y. T. Chow, T. Liu, X. Wen, M. A. Teitell, P.-Y. Chiou, “Photothermal Intracellular Delivery with Self-Aligned Cell Seeding,” Proc. IEEE Int. Conf. on Optical MEMS and Nanophotonics (OMN), Santa Fe, New Mexico, USA, Aug. 2017.
  10. T. Liu, X. Wen, Y.-C. Kung, and P. Y. Chiou, “Fabrication Strategy For Micro Soft Robotics With Semiconductor Devices Integration,” Proc. IEEE Int. Conf. MEMS, Las Vegas, USA, Jan. 2017, pp. 663-666.
  11. X. Wen, T. Liu, and P.-Y. Chiou, “A Hybrid Silicon-PDMS Multifunctional Neural Probe,” Proc. IEEE Int. Conf. on Optical MEMS and Nanophotonics (OMN), Singapore, Jul. 2016.
  12. T. Liu and C.-J. Kim, “Structure-Based Superhydrophobicity for Serum Droplets,” Proc. IEEE Int. Conf. MEMS, Estoril, Portugal, Jan. 2015, pp. 6-7.
  13. T. Liu and C.-J. Kim, “Doubly Re-entrant Cavities to Sustain Boiling Nucleation In FC-72,” Proc. IEEE Int. Conf. MEMS, Estoril, Portugal, Jan. 2015, pp. 1122-1124.
  14. T. Liu and C.-J. Kim, “Microstructured SiO2 Surface Repellant to Liquids without Coating,” Proc. Int. Conf. Solid State Sensors, Actuators and Microsystems (Transducers’13), Barcelona, Spain, June 2013, pp. 1609-1612.
  15. T. Liu, G. Sun, J. J. Kim, C.-K. K. Yang, and C.-J. Kim, “Electrostatic Bottom-Driven Rotary Stage on Multiple Conductive Liquid-Ring Bearings,” Proc. IEEE Int. Conf. MEMS, Taipei, Taiwan, Jan. 2013, pp. 86-89.
  16. G. Sun, T. Liu, P. Sen, W. Shen, C. Gudeman, and C.-J. Kim, “Electrostatically Driven Rotor on Conductive Liquid Ring Bearings,” Technical Digest, Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head Island, SC, June 2012, pp. 78-81.
  17. T. Liu, P. Sen, and C.-J. Kim, “Characterization of Liquid-Metal Galinstan® for Droplet Applications”, Proc. IEEE Int. Conf. MEMS, Hong Kong, China, Jan. 2010, pp. 560-563.
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